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Profile

List of Publications:

  1. "MMM algorithm for TSV based Three-Dimensional Integrated Circuits to obtain Low power and Reliable Clock". International conference ICrtSIV at Don Bosco Institute of technology Bangalore on Feb 22nd 2014.
  2. “STDN based New Architecture for Power Network in 3D IC’s” International Journal of Advanced Research in Electrical,Electronics and Instrumentation Engineering(An ISO 3297: 2007 Certified Organization)Vol. 2, Issue 11, November 2013.
  3. “Analyzing 3D PDNs Using Multiple Clock Domains to Obtain Worst-Case Power Supply Noise and Temperature Variations” International Journal of Scientific & Engineering Research, Volume 4, Issue 12, December-2013 1393 ISSN 2229-5518(IJSER).
  4. “PDN Optimization of 3DIC’s Using TSV Technology”International Journal of Advances in Science Engineering and Technology, ISSN: 2321-9009 Volume- 1, Issue-3, Jan.-2014(IJSET).
  5. "MMM algorithm for TSV based Three-Dimensional Integrated Circuits to obtain Low power and Reliable Clock" Published in Elsevier Editorial journal with Ms. Ref. No.: MEE-D-13-00436 on24th August 2013.
  6. "Mathematical and Statistical Analysis and Power Delivery Design for 3D IC’susing TSV Technologies”The Second International Conference on “Emerging Research in Computing, Information, Communication and Applications”, ERCICA-2014:01-02, August, 2014 at NMIT ,Bangalore.Elsevier science.
  7. “Digital Signal Processing” 4th Edition of DSP text book has been edited according to the requirements of the VTU on August 2012 which was published by Pearson.
  8. “Analyzing 3D PDNs Using Multiple Clock Domains to Obtain Worst-Case Power Supply Noise and Temperature Variations” International Journal of Scientific & Engineering Research, Volume 4, Issue 12, December-2013 1393 ISSN 2229-5518(IJSER).

International & National Conferences:

  1. "Mathematical and Statistical Analysis and Power Delivery Design for 3D IC’susing TSV Technologies” .The Second International Conference on “Emerging Research in Computing, Information, Communication and Applications”, ERCICA-2014:01-02, August, 2014 at NMIT ,Bangalore. Elsevier science.
  2. "MMM algorithm for TSV based Three-Dimensional Integrated Circuits to obtain Low power and Reliable Clock". International conference ICrtSIV at Don Bosco Institute of technology Bangalore on Feb 22nd 2014.
  3. “Analyzing Power Distribution Network in TSV-Based 3-D Processor-Memory Stacks”National Conference On Communication And Image Processing – 2013 (NCCIP-13) held at T.JOHN Institute of Technology, Bangalore-83 on 7th August 2013.
  4. “Low power TSV based 3-d IC data path units” National Conference on Trends in VLSI Design and Technology (NCTVDT-2013) held at Don Bosco Institute of Technology, Bangalore on 02-05-2013 and 03-05-2013.
  5. “Power delivery network In 3-d integrated circuits through efficient estimation of TSV” Two days National conference on Frontiers and advances in information science and technology (FAIST’13) held at RajaRajeswari College of Engineering. On 23rd and 24th may 2013.
  6. “Realtime Implementation of Speech Recognition System with Vector Quantization(VQ)on TMS320C6713DSK” at National Conference ETBMSP-11 held on 26th feb 2011 at RV College of Engineering Bangalore.
  7. “SDR Baseband Signal processing using Model Design Approach”at Conference RCCIT11-Second National Conference on 8th April 2011 MS Engineering college Bangalore.
  8. “PDN Optimization of 3DIC’s Using TSV Technology” at international conference ICEECE held at Chennai on 1-12-2013.

Participated in Workshops: (Attended / Conducted):

  1. Conducted one day workshop at Don Bosco Institute of Technology ,Bangalore in the year 2008.
  2. Attended two day workshop on Antenna and Propagation conducted at Global Academy of Technology Bangalore on during 2009.
  3. Attended two days workshop on Model based design tools conducted at Sir MVIT Bangalore on 08th of august 2011.
  4. Conducted one day workshop on IC DESIGN METHODOLOGIES on 22-02-2013 at Sri Krishna Institute of Technology,Bangalore.